TAGRA 2024

The rise in component temperatures during operation represents one of the most significant challenges that electronic devices confront, as elevated temperatures can negatively impact their functionality and potentially lead to irreversible damage. In order to effectively tackle this problem, the utilization of synthetic jet cooling holds considerable promise for enhancing the efficiency of electronic devices while simultaneously reducing their operating temperatures.
This study not only aims to reduce the thermal load on the components but also contributes to the overall reliability and longevity of the devices. To investigate the effectiveness of synthetic jet cooling in thermal applications, an experimental setup was meticulously developed, incorporating loudspeaker capable of generating synthetic jets. This setup aims to explore how these jets can facilitate enhanced heat transfer and improve cooling performance in various electronic components. By leveraging the unique properties of synthetic jets, which can create localized airflow without the need for moving parts, this research seeks to provide valuable insights into advanced cooling solutions that are essential for meeting the increasing thermal demands associated with modern high-performance electronics.
As electronic devices continue to evolve toward greater integration and miniaturization, effective thermal management strategies become increasingly critical. The findings from this experimental investigation may pave the way for innovative cooling technologies that not only mitigate heat-related issues but also enhance device performance and reliability in a range of applications. This study demonstrates that a finned heat sink height of 1 mm enhanced heat transfer by 42.47%, effectively maintaining the heat sink temperature within an acceptable range.